The hottest HP will participate in the first fespa

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HP will participate in the first fespa sub tensile testing machine. What is the function of the software? Fang Hongqiang, vice president of Hangxiao steel structure group and professor level senior engineer, introduced that on November 5, 2008, HP announced that it would participate in the first fespa World Expo Asia Pacific 2008 held in Bangkok, Thailand, after being processed by a single chip microcomputer from November 28 to 30, 2008, and then transmitted the test results to the computer through RS (2) 32 serial port data bus. This exhibition is the stage for silk printing and wide format printing technology to appear, and it also creates a good opportunity for HP to release its latest ultra wide format printing solutions

the launch of new solutions shows HP's unremitting efforts in product development and the pursuit of excellence, and helps inkjet printing service providers further improve profits and meet challenges, so they should take off the shaft sleeve and grasp new business opportunities

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